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项目 Item |
2016 |
2017 |
2018 |
|
Number of Layers |
gd55光大彩票 Rigid PCB 刚性板 |
2-36 |
gd55光大彩票 2-40 |
gd55光大彩票 2-50 |
Buried Resistance 埋电阻 |
yes |
yes |
yes |
|
gd55光大彩票 Buried Capacitance 埋电容 |
yes |
yes |
yes |
|
Flexible board 柔性板 |
2-8 |
2-8 |
2-8 |
|
Flex-rigid PCB 刚挠结合板 |
gd55光大彩票 2-16 |
gd55光大彩票 2-16 |
2-16 |
|
gd55光大彩票 Buried IC 植入IC |
yes |
yes |
yes |
|
HDI 高密度互连 |
2+n+2 |
gd55光大彩票 3+n+3 |
3+n+3 |
|
Materials |
gd55光大彩票 FR4 ( Shengyi ) |
yes |
yes |
yes |
High Tg 高Tg |
Tg-210 |
Tg-220 |
Tg-220 |
|
EHalongen Free 无卤素 |
yes |
yes |
yes |
|
gd55光大彩票 High Frequency 高频 |
yes |
yes |
yes |
|
Maximum board size 最大成品尺寸 |
|
gd55光大彩票 20*30inch |
20*30inch |
20*35inch |
Board thickness 板厚 |
|
0.21-6.0mm |
gd55光大彩票 0.21-6.0mm |
0.21-6.0mm |
gd55光大彩票 Minimum line width 最小线宽 |
|
3mil-inner 3mil-outer |
gd55光大彩票 2.5mil-inner 2.5mil-outer |
gd55光大彩票 2mil-inner gd55光大彩票 2mil-outer |
gd55光大彩票 Minimum Line gap 最小线距 |
|
3mil-inner gd55光大彩票 3mil-outer |
gd55光大彩票 2.5mil-inner 2.5mil-outer |
gd55光大彩票 2mil-inner gd55光大彩票 2mil-outer |
Outer layer copper thickness 外层最大铜厚 |
|
5OZ |
7OZ |
7OZ |
Inner layer copper thickness 内层最大铜厚 |
|
5OZ |
7OZ |
7OZ |
Min. finished hole size (Mechanical) |
0.15mm |
yes |
yes |
yes |
Min. finished hole size (laser hole) |
0.1mm |
yes |
yes |
yes |
Aspect ratio gd55光大彩票 最大板厚孔径比率 |
|
gd55光大彩票 16:1 |
gd55光大彩票 20:1 |
gd55光大彩票 20:1 |
Solder Mask Types and brand |
gd55光大彩票 NAYA(LP-4G) |
yes |
yes |
yes |
Tamura(TT19G) |
yes |
yes |
yes |
|
TAIYO(PSR2200) |
yes |
yes |
yes |
|
Solder Mask Color 阻焊油墨颜色 |
green;blue;red;white;black |
yes |
yes |
yes |
Impedance Control Tolerance gd55光大彩票 阻抗控制公差 |
5% |
yes |
yes |
yes |
gd55光大彩票 Plug via hole 过孔塞孔 |
Min. size can be plugged |
0.1mm |
0.1mm |
0.1mm |
Max. size can be plugged |
0.70mm |
0.70mm |
0.70mm |
|
gd55光大彩票 Min. annular ring can be kept |
|
gd55光大彩票 3mil |
gd55光大彩票 3mil |
3mil |
Min. distance between the IC pads can keep SM bridge gd55光大彩票 最小IC管距(可保留阻焊桥) |
|
gd55光大彩票 8mil |
8mil |
gd55光大彩票 8mil |
Min. SM bridge for green soldermask |
|
3mil |
3mil |
3mil |
Min. SM bridge for black soldermask |
|
4mil |
gd55光大彩票 4mil |
4mil |
Surface Treatment |
HASL 喷锡 |
yes |
yes |
yes |
ENIG 沉金 |
yes |
yes |
yes |
|
OSP |
yes |
yes |
yes |
|
gd55光大彩票 LEAD FREE HASL 无铅喷锡 |
yes |
yes |
yes |
|
GOLD PLATING 镀金 |
yes |
yes |
yes |
|
IMMERSION Ag 沉银 |
yes |
yes |
yes |
|
IMMERSION Sn 沉锡 |
yes |
yes |
yes |
|
gd55光大彩票 V-Cut |
gd55光大彩票 CNC V-cut, degree |
gd55光大彩票 20%0 |
20%0 |
20%0 |
gd55光大彩票 V-cut by hand, degree |
20%0 |
20%0 |
20%0 |
|
Outline Profile 外形 |
|
CNC |
CNC |
CNC |
Chamfer 圆角 |
The angle type of the chamfer: |
20% |
20% |
gd55光大彩票 20% |
Min. distance of jumping chamfer: |
5mm |
5mm |
5mm |
|
Tolerance of the dimension size外形尺寸公差 |
|
±0.1mm |
±0.1mm |
±0.1mm |
Tolerance of the board thickness |
0.21---1.0 |
gd55光大彩票 ±0.1 |
gd55光大彩票 ±0.1 |
±0.1 |
gd55光大彩票 1.0--2.5 |
±7% |
±7% |
gd55光大彩票 ±7% |
|
gd55光大彩票 2.5-6.3 |
gd55光大彩票 ±6% |
gd55光大彩票 ±6% |
±6% |
|
Tolerance of the finished hole size |
gd55光大彩票 0-0.3 |
gd55光大彩票 +0.08mm |
+0.08mm |
+0.08mm |
gd55光大彩票 0.31---0.8mm |
gd55光大彩票 ±0.08mm |
±0.08mm |
±0.08mm |
|
gd55光大彩票 0.81-1.60mm |
gd55光大彩票 ±0.05mm |
±0.05mm |
±0.05mm |
|
gd55光大彩票 1.61-2.49mm |
gd55光大彩票 ±0.75mm |
±0.75mm |
gd55光大彩票 ±0.75mm |
|
2.5-6.0mm |
gd55光大彩票 +0.15/-0mm |
+0.15/-0mm |
+0.15/-1mm |
|
>6.0mm |
+0.3 /-0mm |
+0.3 /-0mm |
+0.3 /-1mm |
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